Samsung Electronics announced on Tuesday a next-generation memory and storage technology strategy aimed at enhancing the performance of artificial intelligence (AI) infrastructure.

The South Korean chip giant unveiled these strategies at the OCP Global Summit held in San Francisco, United States, which opened on Monday local time.

Samsung outlined three key technology directions designed to improve AI infrastructure performance: high-performance memory, Compute Express Link (CXL)-based memory expansion technology, and data storage and management solutions utilizing next-generation solid-state drives (SSDs).

According to Samsung, Shim Ho-jun, Vice President and Head of the Application Engineering Team, delivered a related speech at the summit.

Shim explained that as AI models continue to scale up and the volume of data required for inference and the demand for key-value (KV) caching increase, memory capacity expansion and data storage technologies have become increasingly important in improving AI system performance, in addition to memory bandwidth.

He added that Samsung is committed to strengthening collaborative design and technical validation with global customers and partners from the early stages of development to optimize the entire AI system.

Samsung also plans to jointly showcase a CXL-based memory expansion solution with AMD at the event to address the memory capacity limitations of existing systems.